It will discuss how to identify the root cause and give potential solutions to prevent the defect and have a robust SMT assembly process. Key words: Head and pillow, failure mode, non wet, reflow soldering, oxidation, warpage, mis-placement . circuit test and ‘escape’ to the customer.
SMT BGA 焊接的一种不良现象:枕头效应(head-in-pillow,HIP)发生 …
2024年5月27日 · 文章来源：SMT工程师之家微信公众号. 枕头效应（Head-in-Pillow, HIP），近来有人又开始将其称作 HoP（Head-of-Pillow），无论称其为 HIP 还是 HoP，所指的皆为 BGA 焊点的不良现象，其得名缘由恰似一个人把头靠在枕头上的形状。 一、BGA枕头效应(Head-in-Pillow,HIP)的发生机理:
There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action.
Key words: Lead-free assembly, Head-in-pillow defect, process optimization, solder paste activity, oxidation (of BGA spheres) and BGA warpage. INTRODUCTION . Head-in-Pillow (HIP) defects are becoming major concerns for the electronics assembly industry. This defect is produced during the reflow of an assembled board when the
Head in Pillow (HiP) Joint UDefinition: Non-coalescence (Non wetting) between the solder ball and the solder paste during reflow process. Also referred to as “Ball and Socket" defect or „Head on Pillow Defect”. Not an „open‟ joint as there is weak intermittent contact. Occurs mostly on corner balls at low DPMO.
SMT BGA枕头效应发生的可能原因与机理 - 商业新知
2021年4月12日 · 枕头效应(Head-in-Pillow,HIP)最主要是用来描述电路板的BGA零件在回焊(Reflow)的高温过程中，BGA载板或是电路板因为受不了高温而发生板弯、板翘(warpage)或是其他原因变形，使得BGA的锡球(ball)与印刷在电路板上的锡膏分离，当电路板经过高温「回焊 …
CSP枕头效应（HiP）原因及应对措施 - gz-smt.com
2018年6月14日 · 一、枕头效应（ Head in Pillow ） 枕头效应（ HiP ）也称球窝缺陷，就是在 smt 回流焊接阶段 CSP 锡球与锡膏没有完全熔合在一起而形成一个整体，从切片和染色实验结果中可以看出， CSP 锡球与 PCB 焊盘上的焊料虽然接触，但存在明显的界线，不能形成有效的电气和 ...
SMT专业术语枕头效应是指什么意思？影响枕头效应的因素
2020年3月19日 · 枕头效应(Head-in-Pillow,HIP)最主要是用来描述电路板的BGA零件在回焊(Reflow)的高温过程中，BGA载板或是电路板因为受不了高温而发生板弯、板翘(warpage)或是其他原因变形，使得BGA的锡球(ball)与印刷在电路板上的锡膏分离，当电路板经过高温回焊区后温度渐 …
These TSCs include a significant number of surface mount technology (SMT) electrolytic capacitors. The SMT connectors include: SMT DIMM connectors, four large hybrid LGA sockets that use...
Head in Pillow Defect - SEM Lab Inc.
2018年10月22日 · Here are some examples of head-in-pillow defect analyzed at SEM Lab, Inc. Head-in-pillow defect at ball-A3. Head-in-pillow defect at ball-B5. This condition is primarily caused by thermal-mechanical warpage of the BGA during the solder reflow process. Some corrective action recommendations can be found in [1]. [1] SMT Troubleshooting Guide ...