From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Cadence Design Systems CDNS recently deepened its multi-year collaboration with NVIDIA NVDA to accelerate computing and ...

SimForm has been a game-changer in injection molding, offering users the ability to quickly & easily predict temperatures, ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Two case studies show the effectiveness of high-res 3D ...

Saudi Arabian petrochemicals giant Sabic (Riyadh; has introduced a family of conductive polymers suitable as a replacement for PA-based polymers used in inline paintable automotive exteriors. Sabic ...

LG Innotek's plan is to continue to enhance its Automotive AP Module. This year, it aims to increase the module's heat dissipation performance, enabling it to operate at up to 95˚C, and significantly ...

Europe funds power fab; PDF’s security acquisition; tariffs; NIST concerns; new ALD tool; Malaysia’s advanced packaging fab; autonomous ships; smart NoC IP; advanced etch tool; Arm’s new release.

LG Innotek is expanding its automotive components business into the vehicle semiconductor market with the launch of an automotive application processor (AP) module.

Abstract: A wafer warpage prediction model for trench field-plate MOSFETs on large diameter wafers is proposed. Trench field-plate MOSFETs have deeper trenches and thicker oxides compared to ...

Professor Ifeanyi Charles Ume founded Akrometrix out of Georgia Tech 30 years ago, to address issues in PCB flatness, using the shadow moiré warpage measurement technique. ... This paper studies board ...