对于wafer-to-wafer和die-to-wafer，供应商可以使用相同的晶圆键合系统。 一些供应商出售这些系统，用于纳米级放置精度的混合键合。 在操作中，裸片被 ...

One major challenge still remains however - the age-old issue of heat. Wafer-scale chips can consume up to 10,000 watts of ...

“A collective die-to-wafer bonding flow is extended beyond the N=2 tier to the N=3 and N=4 tier by collectively bonding multiple layers of dies on top of a target wafer. The N=2 die-level is shown to ...

On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for which imec demonstrated a first proof of concept at ECTC2024. Imec is developing a process ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

A machine takes dies from a wafer for before it moves onto sorting, testing and assembly. (Image credit: Intel) Intel's Kulim facilities are located on the Malaysian mainland.

WILMINGTON, Mass., April 23, 2024--Onto Innovation Inc. (NYSE: ONTO) today announced the release of a new sub-surface inspection capability for the Dragonfly® G3 sub-micron 2D/3D inspection and ...