Apple to reportedly use TSMC's advanced WMCM and SoIC packaging for next-gen A20 and server chips, monthly wafer production ...

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Pickering shares five expert-backed reasons reed relays outperform in wafer probe and parametric test environments ...

(25:32 + Q&A) Dr. Anne Jourdain, imecFrom the First IEEE Hybrid Bonding Symposium Summary: Hybrid bonding is recognized as the key technology for advanced heterogeneous wafer-level system integration.

Infineon reports that reducing the thickness of a wafer by half lowers the substrate resistance by 50%, resulting in over a 15% reduction in power loss in power systems compared to conventional ...

“A collective die-to-wafer bonding flow is extended beyond the N=2 tier to the N=3 and N=4 tier by collectively bonding multiple layers of dies on top of a target wafer. The N=2 die-level is shown to ...

wafer：晶圆，是指硅半导体集成电路制作所用的硅晶片，由于其形状为圆形。 chip：芯片，是半导体元件产品的统称。 die：裸片 ，是硅片中一个很小的单位，包括了设计完整的单个芯片以及芯片邻近水平和垂直方向上的部分划片槽区域。 wafer为晶圆，由纯硅（Si ...