Technology and Research (A*STAR), today announced the launch of the 10th Electronic Packaging Research Consortium (EPRC-10) to address key integration challenges of 3-dimensional (3-D) Packaging and ...

Published 09/2021. F. Qu et al., “Research on Wire Sweep of Integrated Circuit Packaging Based on Three-dimensional Flow Simulation,” 2021 22nd International Conference on Electronic Packaging ...

the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping ...

Three-dimensional combined circuits are playing a highly significant role in electronic devices ... contribute to chips with a high density of interconnects and advanced 3D packaging.

In physics, topological effects are sometimes known to give rise to exotic electronic effects in ... anomalous Hall effect is suppressed in three-dimensional crystals due to different symmetry ...