Jan. 24 (UPI) --Assembly of the Artemis II moon rocket has reached its latest milestone with the stacking of the twin boosters' right forward center segment, NASA announced Friday. The most recent ...

POSTECH and University of Montpellier researchers demonstrate wafer-scale AA-stacked hexagonal boron nitride (hBN) growth.

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.