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Aluminum nitride (AlN) ceramics have actually become an important product in high-tech markets as a result of their ...
OKI (TOKYO: 6703) , in collaboration with NTT Innovative Devices Corporation (Headquarters: Kanagawa Prefecture; President & CEO: Hidehiro Tsukano; "NTT Innovative Devices" hereinafter), has ...
X-Fab has improved 25V isolation for better SPAD integration in its 180nm XH018 fab process. 4x3 SPAD arrays: Original ...
The partnership also plans to explore electric Vertical Take-Off and Landing (eVTOL), energy, and off-highway applications ...
To address these challenges, Microchip Technology (Nasdaq: MCHP) has added the dsPIC33AK512MPS512 and dsPIC33AK512MC510 ...
Powering Up the Future of Data Centers Nvidia‘s (NASDAQ:NVDA) next-generation 800V high-voltage direct current (HVDC) ...
Discover how Penn State’s 2D CMOS computer breakthrough paves the way for ultra-efficient, atomic-scale electronics beyond silicon.
Global silicon carbide (SiC) wafer shipments hit a record high in 2024, with China driving the surge, according to statistics ...
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Korea JoongAng Daily on MSNLG Chem, Japanese firm co-develop electronic component materialLG Chem, Korea's leading chemical firm, said Monday it has jointly developed a high-performance adhesive for automotive power ...
Approach highlights methods for using lower-cost molybdenum electrodes and the impact of oxygen on impeding electrical ...
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