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Circuits Assembly Online Magazine16 小时Opinion
INEMI Publishes New Roadmaps for Board Assembly, Complex Integrated Systems and Laminates
The International Electronics Manufacturing Initiative (INEMI) has released updated roadmaps addressing key challenges and technology advancements in board assembly, complex integrated systems and ...
IEEE7 天
Quantification of Conductor Surface Roughness Profiles in Printed Circuit Boards
Abstract: Conductor (copper) foil surface roughness in printed circuit boards (PCBs) is inevitable due to adhesion with laminate dielectrics. Surface roughness limits data rates and frequency range of ...
Magazine7 天
Doosan Begins Flex Laminate Production at New Plant in Korea
SEOUL – Doosan Corp. has launched mass production at its new flexible copper-clad laminate (FCCL) plant in Gimje, North Jeolla Province, targeting the fast-growing foldable smartphone and wearable ...
英为财情7 天
建滔积层板 (1888)
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