With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).
uses a 'unique three-piece PCB' design. At its CES 2025 presentation, the company only demonstrated the 'high-density' PCB carrying the massive 92 billion-transistor GB202 graphics processing unit ...
uses a 'unique three-piece PCB' design. At its CES 2025 presentation, the company only demonstrated the 'high-density' PCB carrying the massive 92 billion-transistor GB202 graphics processing unit ...
The new PCB is accompanied by a new cooler design, which sees this card occupying just two slots – it’s a far cry from the massive high-end graphics cards we usually see. Nvidia is keeping the ...
Teledyne FLIR, in collaboration with VSI Labs, released its testing plan methodology and the results of its FMVSS standard No. 127 pedestrian automatic emergency braking (PAEB... Learn more about ...
This reference design provides a high-efficiency, high-power-density AC/DC adapter solution with a broad input voltage range of ... It comes with a bill of materials (BOM), schematics, assembly ...