For numerous applications, the development of smart sensors requires Interconnection and Packaging (I&P) technologies providing high-integration density together with a high level of reliability in ...

They need to be good switches with low on-resistance and high off-resistance ... Conventional packaging cannot provide the density of signal connections and the short physical length required ...

One of the core technologies in S-SWIFT is the high-density redistribution layer (RDL) technique. In HDFO packaging, the RDL provides the chip-to-chip interface, and higher-density RDL is essential ...

As shown in table 2, all samples passed T/C G 1500 cycles, UHAST 360 hours and HTS 1000 hours. The embedded trace RDL has been developed as an RDL fabrication process for advanced High-Density Fan-Out ...

The Aerosol Jet HD System is a compact, configurable R&D to production platform that can print a wide range of electronic materials ... the HD System can produce high density cross-over and ...

In 2024, the global market size of Dry Film Photoresist was estimated to be worth USD 939 million and is forecast to reach approximately USD 1191 million by 2031 with a CAGR of 3.5% during the ...

effective thermal management becomes a challenge in 3D packaging due to the high packaging density, requiring innovative solutions to address these complexities. Approximately 90 % of Integrated ...

Novel high-density MT cable assemblies create multiple ... After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design ...

SINGAPORE: FCI, a leading supplier of connectors and interconnect systems, announced its enrolment with the HDP User Group (High Density Packaging User Group International Inc.). HDP User Group is ...

Transistors are core components of many electronic devices ... in this recent paper was so far used to develop ...

The S-SiCap is a high capacitance density and very low profile (<100um thin) silicon capacitor that can be integrated with System-on-Chips (SoC) with advanced packaging processes. It can be customised ...