In 2024, the global market size of Dry Film Photoresist was estimated to be worth USD 939 million and is forecast to reach approximately USD 1191 million by 2031 with a CAGR of 3.5% during the ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

Typically, electronic packaging materials such as glass epoxy with copper ... particularly in high-frequency and high-density applications. As a premier contract manufacturer specializing in intricate ...

Alpha and Omega Semiconductor Limited introduced its AONK40202 25V MOSFET in state-of-the-art DFN3.3×3.3 Source-Down ...

The global polyethylene corrugated packaging market share analysis is poised for significant growth between 2025 and 2035, ...

The S-SiCap is a high capacitance density and very low profile (<100um thin) silicon capacitor that can be integrated with System-on-Chips (SoC) with advanced packaging processes. It can be customised ...

These components are crucial for the integration of liquid cooling systems used in high-density electronic applications ... for miniature parts packaging, and technology service for research ...

Transistors are core components of many electronic devices ... in this recent paper was so far used to develop ...