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ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for ...
Going forward, ROHM will continue to advance the development of SiC modules that balance miniaturization with high efficiency ...
Advances in semiconductor and power electronics technologies, led by increasing deployment of wide-bandgap power devices, are ...
Taiwan Semiconductor Manufacturing (NYSE:TSM) revealed its latest logic process technology, A14, which it expects to improve ...
The "Microfluidics Cooling Market - A Global and Regional Analysis: Focus on Technology Transition, Ongoing Research and Potential Market scenario - Analysis and Forecast, 2025-2040" report has been ...
SUNNYVALE, Calif., April 23, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close ...
Navitas Semiconductor will be exhibiting several GaN and SiC breakthroughs in AI data centres, EVs, motor drives, and ...
The PCB design software market is expected to expand at a high growth rate from 2025 to 2035 with the development of high-end ...
The global polymer foam market size was valued at $83.9 billion in 2019, and is projected to reach $134.1 billion by 2027, growing at a CAGR of 6.0% from 2020 to 2027. Polymer foams, also known as ...
The global antifog packaging films market is projected to experience remarkable growth over the next decade, with its market ...
11 天
IEEE Spectrum on MSNFuture Chips Will Be Hotter Than EverAs chips become increasingly compact and powerful, efficient heat dissipation will be crucial to maintaining their performance and longevity. To ensure this efficiency, we need a tool that can predict ...
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