Aluminum nitride (AlN) ceramics have actually become an important product in high-tech markets as a result of their ...

Designed to support high-power density, state-of-the-art DFN3.3x3.3 Source-Down packaging features center gate technology for ...

A technical paper titled “Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged ... ensuring compatibility with chip embedding as commonly employed in ...

The ASYMTEK Vantage Dispensing system equipped with IntelliJet Jetting system reduced underfill voids and decreased cycle ...

Test vehicles were fabricated to emulate high-density 3D flex packages in textiles ... Fluoroelastomers were utilized as encapsulants to suppress moisture permeation and interaction with the embedded ...

SCHURTER said the UHP is ideal for high-density power architectures common in robotic platforms where miniaturization is ...

Alpha and Omega Semiconductor has introduced the AONK40202 25V MOSFET targeting the power demands of AI servers.

Explore why bonding methods in electronics are critical for performance, reliability, and innovation in today’s high-speed, compact devices.

Alpha and Omega Semiconductor (AOS) has introduced its AONK40202 25V MOSFET in DFN3.3x3.3 Source-Down packaging technology.

ECTC 2024 saw a record number of paper submissions, leading to some really high-quality presentations. Hybrid bonding was a ...

IC packaging process in wire bonding and flip-chip technology ... It has shorter electrical paths, provides better electrical performance, and is suitable for high-speed and high-density electronic ...