TSMC first GAA-based N2 process will enter HVM in the second half of 2025 with strong early adoption from both mobile and HPC ...

TI launches a new automotive LiDAR laser driver, mmWave radar sensor, and BAW clocks, targeting improvements in vehicle ...

Advanced Linear Devices has introduced a voltage balancing IC for series-connected pairs of 3.3V supercapacitors. Inside is a pair of mosfet-like devices with a sharp ‘knee’ in their voltage-current ...

For those we have reported, the title of the piece will include a hyperlink, which will provide detailed information. Dongfeng Motor's automotive-grade MCU chip DF30 set for mass production in 2025 ...

TDK has introduced Class-X2 EMI suppression capacitors that are 20% smaller and more humidity resistant than its previous offerings. Called B3292x, the series meets Grade III Test B for temperature, ...

Other optional features include high Q, low noise metal-insulator-metal capacitors, and P+/N- varactors for optimum linearity. On-chip thick aluminum inductors are available for impedance matching, ...