A design-for-reliability methodology was applied to a micro-BGA assembly with lead-free, 95.5Sn-3.8Ag-0.7Cu solder joints. A rate dependent viscoplastic Anand model was curve fitted from a series of ...

在高密度pcba组装中，bga（球栅阵列封装）因其优异的电气性能和小型化优势被广泛应用。然而，空洞问题始终困扰着制造工程师。ipc-a-610标准对空洞率设限为25%（局部最大空洞面积占焊点面积），而现实中，很多工厂bga焊点空洞率远超标，造成产品长期可靠性隐患。

China accused Defense Secretary Pete Hegseth of espousing a “Cold War mentality” in a speech “filled with provocations” in Singapore on Saturday. “Hegseth deliberately ignored the call ...

The San Francisco District Attorney's office announced Thursday two people are facing murder charges in connection with a series of deadly shootings dating back to 2002.

This paper studies the bending and vibration effects on the fatigue lifetime of ball grid array (BGA) solder joints. The correlation between the fatigue lifetime of the assembly and the heating factor ...