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研究认为,在多代3d nand产品中,三星始终以最高的垂直单元效率领跑行业。 techinsights近期分析了从sk海力士2tb ssd pc811 hfs002tem9x152n(器件:h25t3tdg8c ...
平面 nand 在每个节点上都减小了单元尺寸,而 3d nand 则采用了更宽松的工艺,大约在 30nm 到 50nm 之间。3d nand 内存容量的扩展主要是通过添加垂直层 ...
4日讯,初创公司NEO Semiconductor表示,其3D X-DRAM技术可以生产230层的128Gbit DRAM芯片——是当前DRAM密度的八倍。NEO专注于半导体存储器并开发了X-NAND技术 ...
此前,美光也放慢了量产232层nand芯片的步伐。 统计机构TrendForce的最新报告指出,3D TLC/QLC芯片在本季度的协议价下滑了30~35%,第四季度预计还会下滑 ...
作为3D NAND闪存产业的新晋者,长江存储今年将第一次参加行业权威的闪存峰会(Flash Memory Summit),并首次公开披露即将发布的突破性技术Xtacking。 北京 ...
三星在今年7月发布的850Pro系列SSD上首次使用了3D V-NAND的MLC闪存,其实当时就知道三星迟早会出用3D V-NAND TLC的850 EVO,等了5个月后它终于来了。 三星 ...
During the fabrication of 3D NAND replacement gate memory devices, one of the key process modules involves the formation of the metal gates and wordlines in the memory cell. The process starts when a ...
Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process, structure, and die design. Micron ...
On Monday, memory and storage vendor Micron announced that its new 176-layer 3D NAND (the storage medium underlying most SSDs) process is in production and has begun shipping to customers.
Crossbar estimates that using 20nm 3D NAND process will produce an equivalent lithography of 5nm planar NAND, thereby allowing Samsung to breach the scaling limit. ...
NAND flash process technology has been advancing every 12 months or so. ... The first generation of 3D NAND, 24-layers deep, comes on heels of sub-20nm node 2D NAND, ...