From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

High-NA EUV makes progress toward high-volume manufacturing while optical lithography sees continued advances.

SK hynix begins sampling the world's first 12-layer HBM4 memory samples with up to 36GB capacity, 2TB/sec bandwidth: ready ...

Abstract: A wafer warpage prediction model for trench field-plate MOSFETs on large diameter wafers is proposed. Trench field-plate MOSFETs have deeper trenches and thicker oxides compared to ...

SK Hynix Inc. (or "the company") announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high ...

With NVDA's latest Blackwell architecture, CDNS aims to drive significant advancements in engineering, scientific simulations ...

SimForm has been a game-changer in injection molding, offering users the ability to quickly & easily predict temperatures, ...

South Korean memory chip giant SK Hynix Inc. has begun delivering samples of the world’s most advanced, next-generation high ...

The process, of which competitiveness has been proved through a successful production of the previous generation, helps prevent chip warpage, while maximizing product stability by improving heat ...

The process, of which competitiveness has been proved through a successful production of the previous generation, helps prevent chip warpage, while maximizing product stability by improving heat ...