在当前科技迅速发展的时代， 移动设备的性能与效率 成为了市场竞争的核心。随着微软计划在2026年推出新一代Surface设备，AMD的 Sound Wave Arm SoC也随之浮出水面，成为行业关注的焦点。这款全新的芯片将有望为Surface产品线带来技术革新，尤其是在处理性能和功耗控制方面。

微软今年先后发布了四款Surface Laptop和Surface Pro产品，分别搭载了英特尔代号“Lunar Lake”的酷睿Ultra 200V系列和高通骁龙X Plus处理器，扩展旗下Copilot+ ...

AMD is allegedly working on an Arm-based SoC, codenamed "Sound Wave", in a bid to power Microsoft's Surface laptops next year, claims Kepler via ITHome. Moving away from traditional x86 designs, Sound ...

The resulting IC uses surface acoustic waves and can image objects more than 100 feet away. We would imagine this could be helpful for other applications like 3D scanning, too. The system weighs ...

More information: Xingyu Lu et al, Harnessing exceptional points for ultrahigh sensitive acoustic wave sensing, Microsystems & Nanoengineering (2025). DOI: 10.1038/s41378-024-00864-5 Provided by ...