Innovation paves the way for a high-volume, silicon photonics 400G/lane platform to meet next-generation 3.2T optical communication architectures ...
Infineon will supply bare semiconductor wafers to CDIL, which the Indian firm will process and use for assembly and packaging to make power chipset for use in products like power inverters, solar ...
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Tom's Hardware on MSNASML teams up with Imec for sub-2nm process technologies with High-NA EUV chipmaking toolsASML and Imec this week established a five-year partnership designed to enable Imec's researchers and developers access to ...
Ministry of New and Renewable Energy has ordered that only black wafer, which is the base material for making a solar cell, ...
KLA presented a bullish outlook at the Cantor Fitzgerald Tech Conference, emphasizing strategic growth in process control and ...
Cerebras Systems is challenging Nvidia with six new AI data centers across North America, promising 10x faster inference speeds and 7x cost reduction for companies using advanced AI models like Llama ...
RS: The progress of the compound semiconductor industry can be seen in the increase in substrate size. Your company talks about this, using the phrase ‘Going large’. You feel that the first ...
Mixing financial data with manufacturing analytics can boost efficiency, but there are still pockets of resistance.
US President Donald J. Trump's threat to defund the CHIPS Act and impose tariffs could hurt small tech start-ups by limiting ...
Meta’s Orion AR glasses prototype is expensive to make—like $10,000 per pair, expensive. Orion’s most pricey component is ...
KLA's strategic expansions and investments in advanced semiconductor packaging and AI-enabled devices position it well for ...
NVIDIA's chip roadmap progresses from the B200, part of the Blackwell architecture, to the Rubin architecture, with hints of ...
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