A comparison of brain-image reconstruction techniques. The original images are shown in the top row, while the results of the new deep generative multivew model are shown in the bottom row.

Like handset CMOS image sensors, automotive CIS will likely be built based on the backend wafer reconstruction technology for a shorter verification cycle, according to industry sources.

Get Instant Summarized Text (Gist) A model named Difface can reconstruct 3D facial images from DNA data by mapping single nucleotide differences to facial point clouds. Testing on a Han Chinese ...

“The SPARK platform ideally meets the high-volume manufacturing needs of 3D-WSP with its high throughput and low cost of ownership enabled by capturing a full wafer image in a single ‘shot.

French research lab CEA-Leti has reported stacking three 300mm wafers for improved CMOS image sensors, using hybrid wafer bonding and high-density through-silicon vias. The announcement was made in ...