对于wafer-to-wafer和die-to-wafer，供应商可以使用相同的晶圆键合系统。 一些供应商出售这些系统，用于纳米级放置精度的混合键合。 在操作中，裸片被 ...

On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for which imec demonstrated a first proof of concept at ECTC2024. Imec is developing a process ...

“A collective die-to-wafer bonding flow is extended beyond the N=2 tier to the N=3 and N=4 tier by collectively bonding multiple layers of dies on top of a target wafer. The N=2 die-level is shown to ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

A machine takes dies from a wafer for before it moves onto sorting, testing and assembly. (Image credit: Intel) Intel's Kulim facilities are located on the Malaysian mainland.

WILMINGTON, Mass., April 23, 2024--Onto Innovation Inc. (NYSE: ONTO) today announced the release of a new sub-surface inspection capability for the Dragonfly® G3 sub-micron 2D/3D inspection and ...

These individual dies are then packaged into CPUs, GPUs, and other semiconductor products. However, not all chips perform equally, even if they come from the same wafer. This is where chip binning ...