One major challenge still remains however - the age-old issue of heat. Wafer-scale chips can consume up to 10,000 watts of ...

A machine takes dies from a wafer for before it moves onto sorting, testing and assembly. (Image credit: Intel) Intel's Kulim facilities are located on the Malaysian mainland.

“A collective die-to-wafer bonding flow is extended beyond the N=2 tier to the N=3 and N=4 tier by collectively bonding multiple layers of dies on top of a target wafer. The N=2 die-level is shown to ...

On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for which imec demonstrated a first proof of concept at ECTC2024. Imec is developing a process ...

EQS-News: SUSS MicroTec SE / Key word(s): Product Launch SUSS presents the XBC300 Gen2 D2W platform – the integrated and precise solution for the future of die-to-wafer hybrid bonding 26.05.2025 / ...

These individual dies are then packaged into CPUs, GPUs, and other semiconductor products. However, not all chips perform equally, even if they come from the same wafer. This is where chip binning ...

It vertically links die-to-wafer or wafer-to-wafer via closely spaced copper pads, bonding the dielectric and metal bond pads simultaneously in a single bonding step. However, the enhanced reliability ...

Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters ...