One major challenge still remains however - the age-old issue of heat. Wafer-scale chips can consume up to 10,000 watts of ...

Apple to reportedly use TSMC's advanced WMCM and SoIC packaging for next-gen A20 and server chips, monthly wafer production ...

MPs have narrowly voted in favour of a Bill to legalise assisted dying for terminally ill patients with less than ...

Pickering shares five expert-backed reasons reed relays outperform in wafer probe and parametric test environments ...

(25:32 + Q&A) Dr. Anne Jourdain, imecFrom the First IEEE Hybrid Bonding Symposium Summary: Hybrid bonding is recognized as the key technology for advanced heterogeneous wafer-level system integration.

Infineon’s wafer technology has been qualified and integrated into its smart power stages, which are now being delivered to initial customers. As the ramp-up of ultra-thin wafer technology progresses, ...

“A collective die-to-wafer bonding flow is extended beyond the N=2 tier to the N=3 and N=4 tier by collectively bonding multiple layers of dies on top of a target wafer. The N=2 die-level is shown to ...

die和wafer的关系. 品质合格的die切割下去后，原来的晶圆成了下图的样子，是挑剩下的Downgrade Flash Wafer。残余的die是品质不合格的晶圆。黑色的部分是合格的die，会被原厂封装制作为成品NAND颗粒，而不合格的部分，也就是图中留下的部分则当做废品处理掉。

Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level ...