可能你偶尔会听见硬件工程师，或者芯片设计工程师讲述一些专业名词，比如今天说的wafer、die、cell等。 不知道大家有没有听过，反正我是经常听见，特别是以前在搞芯片设计的公司，而且那个时候公司还买了很多STM32F411的“die”回来自己封装，然后丝印搞上 ...

可能你偶尔会听见硬件工程师，或者芯片设计工程师讲述一些专业名词，比如今天说的 wafer、 die、cell等。 不知道大家有没有听过，反正我是经常听见，特别是以前在搞芯片设计 的公司 ，而且那个时候公司还买了很多STM32F411的“die”回来自己封装，然后丝印搞上公司的产品，这样就“完美”成为 ...

“A collective die-to-wafer bonding flow is extended beyond the N=2 tier to the N=3 and N=4 tier by collectively bonding multiple layers of dies on top of a target wafer. The N=2 die-level is shown to ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

Using Vision PE microscope system, Clemex has developed a new method of automating the analysis of distance between the groove and the edge of the die. First the wafer is correctly positioned under ...

One packaging approach using embedded die technology (eWLB) for FOWLP is a chip-first (mold-first) die assembly in a face-down configuration on an intermediate carrier wafer. In this approach, dies ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

In what is being described as a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimised a hybrid direct-bonding, self-assembly process that has the potential to ...

In concert with the conference focus on wafer and die level probing, Aehr Test will be showcasing its FOX-P wafer level, singulated die and module solutions, including its WafterPak™ Contactors ...

This greatly impacts final yield and cost savings through reduced scrapped wafer/die stacks. "Customers are demanding 100% inspection capability with production-worthy throughput," says Mayson ...