The discipline involves the identification and categorisation of various defect patterns on wafer maps, often using advanced machine learning and deep learning techniques. By deciphering complex ...

Abstract: A method for modeling the variations in defect levels in circuits produced on modern integrated circuit manufacturing lines is described in this paper. The effects on defect and fault ...

PiFM combines atomic force microscopy with chemical imaging, offering insights into molecular orientation and surface ...

Materials Science and Engineering, Penn State University, University Park, Pennsylvania 16802, United States Department of Chemistry, Penn State University, University Park, Pennsylvania 16802, United ...