the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping ...

Technology and Research (A*STAR), today announced the launch of the 10th Electronic Packaging Research Consortium (EPRC-10) to address key integration challenges of 3-dimensional (3-D) Packaging and ...

Published 09/2021. F. Qu et al., “Research on Wire Sweep of Integrated Circuit Packaging Based on Three-dimensional Flow Simulation,” 2021 22nd International Conference on Electronic Packaging ...

Three-dimensional combined circuits are playing a highly significant role in electronic devices ... contribute to chips with a high density of interconnects and advanced 3D packaging.