Integrated circuits have evolved from simple microchips to complex, nanoscale marvels, driving advances in computing, ...

Explore why bonding methods in electronics are critical for performance, reliability, and innovation in today’s high-speed, compact devices.

Trends involve advancements in coatings with enhanced corrosion resistance, addressing the need for long-lasting protection in various industrial settings. The electronic and electrical industry ...

High-performance silicone sealants, known for their durability and weather resistance, are in demand. Trends in Vietnam may include the adoption of these sealants in applications where longevity and ...

The application of three-dimensional common electronics that can be directly pasted on arbitrary surfaces in the fields of human health monitoring, intelligent robots and wearable electronic devices ...

Three-dimensional combined circuits are playing a highly significant role in electronic devices. In comparison to traditional 2D circuits ... This technology is expected to contribute to chips with a ...

Center for Joining and Electronic Packaging, State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and ...

the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping ...

Therefore, it is a great challenge to master wire sweep in IC packaging process. This paper takes Low Profile Fine Pitch Ball Grid Array (LFBGA) as the research object, applies moldex3D ...