Abstract: Interfacial shear stress, peeling stress, and die cracking stress due to thermal and elastic mismatch in layered electronic assemblies are one of the major causes of the mechanical failure ...

Two Micro BGA with similar dimension but different alloy compositions were used in the life testing to observe crack propagation mechanism under thermal cycling stress. Standard metallurgical ...

The process of melting solder to bond electronic components to a substrate, during which thermal cycles can induce stress. Finite element analysis (FEA): A computational method used to model and ...

State Key Laboratory of Polymer Physics and Chemistry, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, Changchun 130022, People’s Republic of China ...

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Finite element analysis by Li et al. (2021 ... which suggests that this region may be subjected to hydrostatic stress. The materials surrounding this region have experienced an extensive shear ...