Abstract: A finite element analysis model of a printed circuit board assembly (PCBA) was established. The model was subjected to a reflow soldering temperature profile to analyze the temperature ...

Figure 1 illustrates the response of two different solder pastes under shear forces. Paste A has a higher initial viscosity that decreases more significantly under shear stress. This behavior suggests ...

Finite Element Analysis is an engineering tool that reduces the number of physical prototypes produced. In the aerospace industry, the tool provides insights into loads and stresses an aircraft ...