3D printed solder stencil on PCB, after applying solder paste. [Jan] says that the printed stencil had a few defects but it otherwise worked fine for 0.5 mm pitch ICs and 0402 resistors ...

If an embedded design is densely populated with 0201 or01005-type packages and tight assembly processes aren’t specified, thiscombination can create multiple board defects, such as tombstoning,skewing ...

The SPI HS30 uses a 3D laser triangulation sensor and intelligent vision algorithm to accurately inspect numerous kinds of solder paste defects. The SPI HS30 measures volume, height, area, and ...

A reflow profile with a high ramp-up rate or a too-rapid temperature increase can lead to solder splattering and formation of solder balls. If the temperature increases too quickly, the flux may not ...

Few manufacturers will find it economical to use all four inspection stations, though. Post paste printing. To a large extent, solder defects originate from faulty paste printing. After applying ...

If you’re struggling with oxidised pads and components, combat the challenge with Koki’s S3X58-M500C-7 powerful wetting, no-clean solder paste Most engineers and operators have experienced poor solder ...

PF606-P solder paste has been adopted in this process for ... minimizing void formation and avoiding short defects caused by ball volume expansion due to voids. This makes PF606-P a preferred ...