it is well known that 60-70% of all solder defects can be traced back to the printing defects such as solder bridging, cold slump and Uneven Solder Paste Deposit while fine tuning the reflow profile ...

This paper focuses on the solder paste deposition process. With an approximated cause ratio of 50 - 70% of post assembly defects, solder paste deposition represents the most significant cause ...

A very common defect involves solder balls or beads on two-pole components (chips), and is thus referred to as beading. Beading is caused when solder grains in the paste make their way under the ...

HERAEUS WS5112 series spatter-free type 7 (2~11um) solder paste for fine pitch applications, reduces defects such as solder balling and solder beading. Type 6 (5~15um ...

Component tolerances address paste imbalance on individual devices. Solder paste deposit imbalance is a key factor in the formation of many reflow soldering defects, including tombstones, drawbridges, ...

Apart from defect detection, Viscom says its 3-D SPI can accomplish much more. The SPI-AOI-Uplink function links paste inspection and post-reflow inspection results for both easy and effective process ...

The SPI HS30 uses a 3D laser triangulation sensor and intelligent vision algorithm to accurately inspect numerous kinds of solder paste defects. The SPI HS30 measures volume, height, area, and ...