The wetting performances of these solder pastes on different substrates were studied under various reflow profiles. The test results of solder ball, slump and printing properties indicate that with a ...

A reflow profile with a high ramp-up rate or a too-rapid temperature increase can lead to solder splattering and formation of solder balls. If the temperature increases too quickly, the flux may not ...

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The experiments were carried out with a different ratio between the standard and low-temperature pastes. It was measured whether changing the amount of bismuth in the solder paste changed the amount ...

Supporters claim the bill will lower housing costs, while critics argue it could leave homeowners vulnerable to shoddy construction practices. 40 Under 40 Let's celebrate PBN's 26th Annual 40 ...

MATIPECA, Departamento de Química─CCT, Universidade Estadual da Paraíba, 58429-500 Campina Grande, PB, Brazil Núcleo de Pesquisa e Extensão LACOM, Universidade Federal da Paraíba, 58051-900 João ...