3D printed solder stencil on PCB, after applying solder paste. [Jan] says that the printed stencil had a few defects but it otherwise worked fine for 0.5 mm pitch ICs and 0402 resistors ...

It is generally agreed that, on average, 40% to 60% of the defects generated by a surface mount production line can ...

PF606-P solder paste has been adopted in this process for ... minimizing void formation and avoiding short defects caused by ball volume expansion due to voids. This makes PF606-P a preferred ...