Space-Saving Device Offers Low Max. RthJC of 0.36 °C/W and Wettable Flanks to Improve Thermal Performance and Solderability ...

To provide higher efficiency for industrial applications, Vishay Intertechnology has introduced a new 80 V TrenchFET Gen IV n ...

Vishay Intertechnology, Inc. (NYSE: VSH) has announced the release of the SiEH4800EW, an 80 V TrenchFET® Gen IV n-channel ...

To enhance efficiency for industrial applications,, Inc. has introduced a new 80V TrenchFET Gen IV n-channel power MOSFET in the PowerPAK 8x8SW bond wire (BWL) package, providing best-in-class ...

Radxa NIO 5A is an upcoming Mediatek Genio 520 SBC in credit card/Raspberry Pi form factor that should offer a more ...

A new n-channel MOSFET in a slim 8x8 mm package sets a benchmark with just 0.88 mΩ RDS(on), 0.36 °C/W thermal resistance, and ...

The intended use is not certain, but the FCBGA technology (Flip Chip Ball Grid Array) suggests solderable notebook processors from the Nvidia cooperation. During packaging, the CPU and GPU chips ...

School of Materials Science and Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, Republic of Korea Article Views are the COUNTER-compliant sum of full text article ...