Alpha and Omega Semiconductor Limited introduced its AONK40202 25V MOSFET in state-of-the-art DFN3.3×3.3 Source-Down ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

Typically, electronic packaging materials such as glass epoxy with copper ... particularly in high-frequency and high-density applications. As a premier contract manufacturer specializing in intricate ...

The S-SiCap is a high capacitance density and very low profile (<100um thin) silicon capacitor that can be integrated with System-on-Chips (SoC) with advanced packaging processes. It can be customised ...

These components are crucial for the integration of liquid cooling systems used in high-density electronic applications ... for miniature parts packaging, and technology service for research ...

CES Transactions on Electrical Machines and Systems Proposed multiple power module with DBC-staked units packaging. Credit: CES Transactions on Electrical Machines and Systems Professor Ning ...

Transistors are core components of many electronic devices ... in this recent paper was so far used to develop ...

This heightened demand for packaging solutions is poised to drive a parallel increase in the need for High-Density Polyethylene (HDPE), a key material used in bottle manufacturing. Browse in-depth ...

It provides high-density die-to-die connections, high I/O counts, and fast signal transmission. The use of a silicon bridge die achieves a die edge linear density (wire/mm/layer) that is an order of ...