Wolfspeed specifically designed its latest generation of SiC MOSFETs to be a better fit for both hard- and soft-switching ...

The global ball grid array (BGA) packaging market is poised for steady growth, with market size projected to reach USD 1.29 ...

The high bandwidth memory market thrives on HPC expansion, demanding stacked solutions, advanced interposers, and seamless integration, enabling faster data flows, lowered latency, and elevated ...

Despite TSMC estimating that the mass production of silicon photonic (SiPh) co-packaged optics (CPO) technology will still ...

Ampcera® is at the forefront of innovation, dedicated to redefining energy storage through cutting-edge solid electrolyte ...

Researchers have created a recyclable, bio-based alternative to thermoset plastics using dihydrofuran (DHF). Cornell ...

It is a kind of thermoplastic which is famous for its tensile strength. Its unique properties can stand high temperatures. Description: HDPE is a boon to developing countries like India where it is ...

Samsung Electronics (SSNLF) warned of slower demand for its AI chips in the first quarter of 2025 partly due to U.S. export ...

New connectivity standard brings performance improvements and a bunch of new features, but it may take years before they are ...

Mouser Electronics, Inc., As an authorized distributor, Mouser Electronics, Inc. is focused on the rapid introduction of new ...