资讯

EE World Online12 小时
Source-down packaging improves power MOSFET thermal performance
Alpha and Omega Semiconductor Limited introduced its AONK40202 25V MOSFET in state-of-the-art DFN3.3×3.3 Source-Down ...
TechAnnouncer20 小时
Key Innovations and Highlights from ECTC 2024
ECTC 2024 saw a record number of paper submissions, leading to some really high-quality presentations. Hybrid bonding was a ...