Delamination occurs when there is a mismatch in coefficients of thermal expansion (CTE) between the encapsulate materials, such as the mold compound used to encapsulate the semiconductor chip and the ...
Contractors at the Idaho Cleanup Project remove support structure from the S1W naval propulsion prototype in preparation for the facility’s demolition (Photo credit: USDOE Office of Environmental ...
Infrasense has completed an advanced evaluation of 17 bridge decks and associated approach and departure slabs in Whiteside County, Illinois. Using a specially equipped survey vehicle, infrared ...
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