苹果一直和台积电先进封装有深度合作研发，也总是首批采用最先进制程的高净值客户。苹果比别家更有迫切需求采用先进封装技术压低成本。尤其是3nm流片和晶圆成本已经一倍于5nm，2nm成本继续翻一倍还不止，就是再高净值客户，也无法承受了。

In Shenzhen—a city renowned for its youthful demographic—how did Art Week spark the creative passion of its young audience? What kind of art resonates with the Generation Z? Driven by curiosity, GenZ ...