To store ever more data in electronic devices of the same size, the manufacturing processes for these devices need to be studied in greater detail. By ...
Apart from this, the company announced key advancements in its product suite for 3D interconnect process control, unveiling the 3Di technology on the Dragonfly G3 system and the new EchoScan system.
SK Hynix's expansion of NAND supply suggests Samsung may recognize its current NAND process technology is no longer sufficient to maintain its previously dominant productivity levels. Samsung ...
Floating-gate 64-layer 3D NAND technology is found to be more sensitive to TID effects than charge-trap 176-layer and 128-layer 3D NAND chips under identical irradiation conditions. However, ...