Every manufacturer has a similar but different process for their hyperscale 3D NAND devices. Every manufacturer also has different phrases and labels for the various geometric factors that describe ...

In NAND Flash technologies, this has led to the market dominance of 3D structures instead of 2D planar devices ... an extra mini slit process is introduced to cut the center dummy channel hole and ...

New V-NAND breaks through current cell stacking limitation in 3D NAND with the industry's first 100+ layer single-tier design for superior ... Samsung’s unique ‘channel hole etching ...

In any case, the 294 layers (including active and dummy layers) are an important milestone for YMTC and the whole flash memory industry. 232 active layers is not a record layer count for 3D NAND ...

Researchers find a faster way to etch deep holes for 3D NAND Plasma-based cryo-etching technique doubles etch speed, improving efficiency Faster etching might mean cheaper storage, but real-world ...