OMNIVISION announced the new OX01N1B image sensor for in-cabin automotive driver monitoring systems (DMS). The device is the newest addition to OMNIVISION's ...

Japanese startup Rapidus plans to open its 2-nm pilot fab in April 2025, aiming to rival TSMC & Samsung. CEO Atsuyoshi Koike highlights their single-wafer processing for faster cycle times, with ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. This paper details a real-world use case where dummy ...

Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system. Optimal adhesion is achieved in bond line thicknesses of 0.001-0.003 inch, ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. New fault isolation technique using 3D X-ray ...

Mass reflow (MR) processes face challenges with package warpage and solder joint quality in fine-pitch devices. Laser-assisted bonding (LAB) offers precise, localized heating, enhancing soldering ...

Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. The Electronic Components & Technology Conference ...

Plasma technology improves electronics manufacturing, reduces oxide layers without the use of flux, prevents delamination, improves adhesion and enables environmentally friendly, high performance ...

The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...

Littelfuse, Inc. announced the release of the IXD2012NTR, a high-speed, high-side and low-side gate driver designed to drive two N-channel MOSFETs or IGBTs in a half-bridge ... Littelfuse, Inc.

For 30 years, Nidec SV Probe has been providing advanced testing solutions for a broad range of semiconductor devices, operating manufacturing and support sites worldwide in the USA, SEA, Europe, ...