资讯

Huawei has been actively developing its domestic chip supply chain and enhancing its technological capabilities and is said ...
Anglia Components has signed an agreement to support and supply a full range of legacy and new memory products.
AccelerComm the developer of advanced 5G technology for satellite networks, has closed a funding round totalling $15m.
The UK Electronics Skills Foundation (UKESF) has announced the launch of the Semiconductor: Skills, Talent and Education ...
Space businesses are queueing up to get payloads into space. Others are looking to clean up the mess they leave behind.
"Advanced packaging is one of the primary vehicles for advancing compute density in AI clusters and cloud," said Will Chu, ...
AMD acquires photonics specialist Enosemi in a move that’s intended to boost its co-packaged optics capabilities.
SCI Semiconductor raises £2.5m towards developing its security-enhanced MCU based on CHERI, a memory securing framework.
SEGGER’s line of J-Link debug probes can now be used to both download a program into and debug Allegro MicroSystems MCUs.
TSMC has announced that it will be establishing its first European Design Centre (EUDC) in Munich later this year.
The key to modern asymmetric cryptography is to create an equation that is easy to solve in one direction but difficult to ...
Archer Materials manufactures first chip that combines the company’s gFET sensors with electrical readout circuitry.