Hirose introduces the FH79 Series back-flip FPC connector with a 40% reduction in width, targeting automotive and other harsh ...

KOA Speer’s WN73H metal thin-film chip resistors deliver power ratings of 0.3 W in a 0306 package and 1 W in a 0612.

Innovations in AI, AIoT, edge computing, and sensor fusion are driving the next generation of advances in smart cities and ...

Bourns’ SRP2512CL and SRP3212CL power inductors deliver reduced losses and high efficiency to meet DDR5 memory specifications ...

The next wave of smart home innovations will come with a shift toward on-device AI, small language models, and multimodal ...

STMicroelectronics claims first IMU with dual MEMS accelerometer and embedded AI with impact detection up to 320 g.

NXP’s NTAG X DNA connected NFC tag, compatible with any NFC mobile device, combines high-density memory and a high data rate.

Circuit protection manufacturers boost performance and deliver smaller footprints for applications ranging from vehicles to ...

Smart home innovation requires reliable multi-protocol connectivity, advanced sensing, and efficient on-device inferencing.

Silicon Labs launches its first Series 3 wireless SoCs, built on the 22-nm process node, targeting line-powered and ...

The U.S. Cyber Trust Mark, announced by the U.S. government on Aug. 10, 2023, represents a landmark moment for IoT security.

NXP’s OrangeBox 2.0 automotive development platform integrates AI, post-quantum cryptography, and SDN for secure ...