Soitec, the French wafer manufacturer has  announced a strategic collaboration with Powerchip Semiconductor Manufacturing ...

Sumitomo Electric and Osaka Metropolitan University have successfully fabricated a GaN-HEMT on a 2-inch polycrystalline ...

Under the collaboration, Soitec will supply PSMC 300mm substrates incorporating a release layer, Transistor Layer Transfer ...

CircupositTM SAP8000 electroless copper is an innovative metallization technology designed for AI server CPU and GPU chip applications. This ionic base catalyst process is optimized for advanced ...

TSMC's demand for CoWoS material has cascaded to impact suppliers of BT substrate base materials, causing the memory market ...

Under the collaboration, Soitec will supply PSMC 300mm substrates incorporating a release layer, Transistor Layer Transfer (TLT) ready, to support a new demonstration of advanced 3D chip stacking at ...

glass core substrates (GCS), substrate-like PCBs (SLP), and embedded die technologies. Each of these platforms addresses specific requirements across applications ranging from high-performance ...

According to Etnews, Samsung is preparing for the future semiconductor market and plans to introduce glass substrates to improve packaging. This can be done by replacing Silicon interposers with Glass ...

Mitsubishi Gas Chemical (MGC), the world's leading supplier of BT substrate base materials, has notified clients of delayed ...

Nearly 12% believed that a method development paper should contain at least 30 examples in its substrate scope ...

Explore how sputtering thin films through Physical Vapor Deposition (PVD) enables high-performance coatings for electronics, ...