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晶通科技获得数亿元融资
晶通科技主要从事与Fan-out晶圆级先进封装相关的产品设计研发、生产、销售及咨询服务。为包括移动互联网设备、高频射频设备、物联网(IoT)、汽车、工业和医疗电子产品在内的众多终端市场提供了全面的集成电路扇出型晶圆级先进封装(FOWLP)和扇出型系统级先进封装(FOSiP)解决方案。近日,晶通科技获得数亿元融资。本轮融资 ...
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