两种类型的装配工艺使用混合键合——wafer-to-wafer和die-to-wafer。 在wafer-to-wafer中，芯片在晶圆厂的两个晶圆上加工。然后，晶圆键合机取出两个晶圆 ...

A technical paper titled “Multi-tier Die Stacking Through Collective Die-to-Wafer Hybrid bonding” was published by researchers at imec, Brewer Science and SUSS MicroTec Lithography GmbH. “A collective ...

苏州芯慧联半导体科技有限公司拟进行存续式分立，分立公司将从事HBM（高带宽存储器）、3D闪存生产制造的混合键合&熔融键合（包含Wafer to Wafer&Die ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

This facility takes the incoming dies and mounts them onto their PCB substrates ... Intel's Malaysia facilities don't include a wafer fabrication plant. The wafers are shipped to Malaysia from ...

This greatly impacts final yield and cost savings through reduced scrapped wafer/die stacks. "Customers are demanding 100% inspection capability with production-worthy throughput," says Mayson ...