A machine takes dies from a wafer for before it moves onto sorting, testing and assembly. (Image credit: Intel) Intel's Kulim facilities are located on the Malaysian mainland.

On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for which imec demonstrated a first proof of concept at ECTC2024. Imec is developing a process ...

“For die-to-wafer what is important is to have the wafer surface really clean, to have absolutely no particles and no organic contamination. So the tool, which will put the dies on the wafer, needs to ...

This greatly impacts final yield and cost savings through reduced scrapped wafer/die stacks. "Customers are demanding 100% inspection capability with production-worthy throughput," says Mayson ...

These individual dies are then packaged into CPUs, GPUs, and other semiconductor products. However, not all chips perform equally, even if they come from the same wafer. This is where chip binning ...

It vertically links die-to-wafer or wafer-to-wafer via closely spaced copper pads, bonding the dielectric and metal bond pads simultaneously in a single bonding step. However, the enhanced reliability ...

Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...