Singapore, 30 June 2009 – The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced the launch of the 10th Electronic ...

the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping ...

Therefore, it is a great challenge to master wire sweep in IC packaging process. This paper takes Low Profile Fine Pitch Ball Grid Array (LFBGA) as the research object, applies moldex3D ...

have agreed to a two-year joint exploration and development program in the field of inspection and metrology for three-dimensional (3D) packaging. Analysts predict the 3D packaging market to grow ...