A reflow profile with a high ramp-up rate or a too-rapid temperature increase can lead to solder splattering and formation of ...

The SPI HS30 uses a 3D laser triangulation sensor and intelligent vision algorithm to accurately inspect numerous kinds of solder paste defects. The SPI HS30 measures volume, height, area, and ...

Few manufacturers will find it economical to use all four inspection stations, though. Post paste printing. To a large extent, solder defects originate from faulty paste printing. After applying ...

In particular, a new type of packaging defect phenomenon—die-pop—is observed ... Together with the appropriate selection of the solder paste volume and the bond line thickness (BLT) of solder layer, ...

PF606-P solder paste has been adopted in this process for ... minimizing void formation and avoiding short defects caused by ball volume expansion due to voids. This makes PF606-P a preferred ...

If you’re struggling with oxidised pads and components, combat the challenge with Koki’s S3X58-M500C-7 powerful wetting, no-clean solder paste Most engineers and operators have experienced poor solder ...