The process of chip design is a complex and multi-step endeavour that involves various stages from initial system specifications to manufacturing. Each step is crucial in achieving the goal of ...

With the semiconductor industry moving toward 3D DRAM ... These models can capture the evolution of mechanical stress throughout a process integration flow and can be used to optimize material ...

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...

Ferromagnetic semiconductors (FMSs) combine the unique properties of semiconductors and magnetism, making them ideal ...

Several flavors of CFETs have been proposed, including monolithic and sequential process flows. In a sequential process flow, top-tier devices are processed sequentially after transfer of a blanket ...